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Taping & Wafer mounting for the dicing process.
1:09
YouTubeAmerican Precision Dicing ,Inc.
Taping & Wafer mounting for the dicing process.
As part of the wafer dicing process the wafer has to be mounted on a tape and ring assembly. This is used to hold the wafer in place as its being cut by the dicing saw. For any questions on dicing and/or services information, Please contact American Precision Dicing, Inc. Sales: (408)539-9880 email : www.wafer-dicing.com/contact
3.1K viewsNov 13, 2020
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